RapidIO is a high performance, low pin count, packet switched, full duplex, system level interconnect architecture. The architecture addresses the need for faster bus speeds in an intra-system interconnect for microprocessors, digital signal processors and communications. RapidIO interconnect architecture is partitioned into a layered hierarchy of specifications which includes Logical, Common Transport and Physical layers, in which the Physical layer defines the interface between two devices and the packet transport mechanism, flow control and electrical characteristics. KNiulink RapidIO PHY offers the physical layer specification solution as defined in the RapidIO Specification Rev 4.0/3.1/2.2. The IP supports four-lane running at different transmission speeds up to 6.25/ 10.3125/25.78125Gbps. 

 With sophisticated architecture and advanced technology, KNiulink multi-mode transceiver IP with PMA and PCS layer is designed for low power and high performance application. It is highly configurable and can be tightly integrated with the user logic or SOC resources; it can support a wide variety of serial data transmission protocols with link rate up to 25/28/32Gbps.

 “The Art of Silicon Sculpting”, the job to sculpt silicon to match customer and application specific performances and functionalities. From the concept or from specifications, we follow the customer and project phases till the release of production.

Our methodology is inspired by the design for quality approach: since the beginning for our design teams the only goal is a device matching requested performances and in production with the right reliability and yield.
In Canova tech you will find People ready to hear your needs and to be involved in a new challenge.

 “The Art of Silicon Sculpting”, the job to sculpt silicon to match customer and application specific performances and functionalities. From the concept or from specifications, we follow the customer and project phases till the release of production.

Our methodology is inspired by the design for quality approach: since the beginning for our design teams the only goal is a device matching requested performances and in production with the right reliability and yield.
In Canova tech you will find People ready to hear your needs and to be involved in a new challenge.

 We know how to manage energy. Energy efficiency, harvesting and scavenging, battery-less or long-life battery operations, implantable and wearable devices are hot topics and the markets are more and more demanding better performances and innovative solutions.

we do have solutions for these emerging applications. And these solutions are now bundled in IP platforms and available to be tested and to validate the system concepts of our customers.

Starting from these IP platform, our customer can reduce dramatically the initial investments and  short the Return of Investment with a fast Time to Market.

 Out of a mixed signal IC and out of your board, the world is based on sensors, batteries, mechanical actuators and analog signals. Interfacing with the outside world requires specific expertise and know-how to implement sensor and signal conditioning, analog to digital conversion and driving external actuators, especially in the case of noisy, harsh environments, like industrial applications.

We put in Conditioning  and Conversion IP platforms all our skills and experience to manage analog signals and this technology is available to our customer willing to have shortly and without risk his specific and proprietary device.

When the Host SoC technology scaled down to the level of FinFET you do not have anymore the Voltage you need to get out to an USB Plug and an embedded USB Repeater is then needed.
You're certaintly thinking on something special for your product and we're willing to listen from you and adapt our IPs on purpose.
Our IPs are designed to allows a very fast and risk-less migration to the technology node and foundry vendor you're use to work with.
Here you can find the foundation IPs of our embedded USB Solutions.

 Since 2012, thanks to the intense and constant commitment of Canova Tech engineers in the USB I/F standardization committees and the successful product co-development done with market leaders and innovators, Canova Tech is offering the best and most robust Semiconductor IP solutions for the integration of USB Power Delivery, USB Type-C and embedded-USB interfaces in your products.

Our USB Semiconductor IPs are in fact integrated in multiple high-runner standard products of our customers which are addressing the mobile phone and personal computer markets.

 Our Engineers attend and contribute IEEE 802.3 Ethernet Working Group and OPEN Alliance SIG standards comittees to explore how to innovate outside the core, partner with the best Engineers in the industry and develop the culture that truly fosters innovation.

Thanks to such effort Canova Tech is today offering silicon-proven and in-development Automotive Ethernet Physical Layer IP blocks designed to successfully sunstain the increasing demand of quality, safety and efficiency.  

 The CT25203 implements the analog front end of an IEEE 802.3cg® 10BASE-T1S physical layer.
It can be used in conjunction to other analog and digital blocks like (a) the CT25205 to implement a complete physical layer ethernet device, (b) the CT25207 to implement a complete OPEN Alliance PMD Interface and (c) the CT25209, the CT25208 and the CT25205 to implement a complete OPEN Alliance MACPHY (see next page for details).
The CT25203 has been designed in GlobalFoundries 130n-BCD process but also successfully and timely ported in other BCD silicon process technologies.
Availability of a complete IEEE physical layer Test Chip vehicle (CT25205_TC) and Evaluation Boards.
The BCD process is required to meet all EMI directives to be used in the Automotive and Industrial environments.

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